Cold Chip-Off Forensics Training


Date: 18 - 19 March 2019
Venue:    GERMANY, 76870 Kandel, Barthelsmühlring 24
Presented by:  Teeltechnologies Canada
Organiser:  mh SERVICE GmbH
Course language: English


Why come?

The NEW 2-Day Cold Chip-Off Training offers digital forensics professionals new techniques for removing memory and other IC chips from digital devices using a “no heat” process. In this class you’ll explore the latest trends and tools for chip removal, with a focus on milling, polishing, and reballing.


Students attending our Cold Chip-Off class will receive in-depth instruction, and first-hand experience in; the use of an UltraTec Polishing Machines, with a focus on practicing reballing techniques for reads, and will conclude with data acquisition.


As this class is meant to build upon our Chip-Off 2.0 with Certification training, it is recommended that students interested in this course have a good theoretical and practical understanding of chip preparation, handling, and removal techniques.

This course is for law enforcement only.


Students should bring their own laptops whenever possible.
Laptop requirements:

  • Windows 7, 8 und 10
  • macOS with Bootcamp Windows 7, 8 and 10
  • min. 8 GB RAM, min. 100 GB Storage

You must have admin rights or have the admin password for software installation.
NOTE: ALL Windows updates should be done prior to class.

What will I learn?

Day 1

  • Review of Chip Off process
  • Introduction to UFS chips
  • Alternative way to reball a chip
  • Non heat chip removal using the milling process
  • Non heat chip removal with the polishing process
  • Demos and student hands on practical of both processes

Day 2

  • Continued milling and polishing practice
  • Using the Medusa Pro for chip off reads
  • Alternative Reading Tools for chip off
  • Introduction of DediProg UFS reader with student practical


Upon successful completion of the course, students will be awarded a Certificate of Completion.

Students attending this class will receive an Essential Kit for Reballing and the handling of chips which includes:

  • BGA Reballing Station Chip Holder Repair Base
  • 4 Stencils (BGA 221, BGA529, BGA169/162, UFS BGA95)
  • Lead Free SMT Low Heat Solder Paste (Sample Size)
  • Aluminum Foil Tape (Sample Size)

About the presenter:

Teeltechnologies provides mobile forensic training classes, tools, and services to the digital forensic community. We have been successfully training law enforcement, military, and government agencies, throughout Europe, and offer a complete mobile classroom that enables us to set-up where needed.

 Futher information and registration:

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+49 (0) 7275 404440